What is the structure of the microphone?

Release time:

2021-01-22

Take omnidirectional MIC, diaphragm type pole ring connection type as an example 1. Dust screen: Protect the microphone head, prevent dust from falling onto the diaphragm, prevent external objects from puncturing the diaphragm, and have a short-term waterproof effect. 2. Housing: The support of the entire microphone head, with other components encapsulated in the housing, is the ground point for the microphone and can also serve as an electromagnetic shield. 3. "Diaphragm: It is a major component of acoustic to electrical conversion, consisting of a taut Teflon plastic film attached to a thin metal ring. The side of the film in contact with the metal ring is coated with a very thin metal layer. The film can be charged, and is also an electrode plate that forms a variable capacitance, and can vibrate.". 4. Gasket: The distance between the two electrode plates of the supporting capacitor is left with a gap to provide a space for the vibration of the diaphragm, thereby changing the electrical capacity. 5. Back plate: The other electrode of the capacitor is connected to the G (gate) electrode of the FET (field effect transistor). 6. Copper ring: Connect the electrode plate to the G (gate) electrode of the FET (field effect transistor) and play a supporting role. 7. Cavity: Fix the plate and ring to prevent short circuit to the housing (S (source) and G (gate) electrodes of FETs). 8. PCB assembly: Equipped with FETs, capacitors, and other devices, it also serves to fix other components. 9. PIN: Some microphones have a PIN (pin) on the PCB, which can be soldered together with other PCBs to connect another front pole type and back pole type. The structure is also slightly different.

Take omnidirectional MIC, diaphragm type pole ring connection type as an example
1. Dust screen:
Protect the microphone head, prevent dust from falling onto the diaphragm, prevent external objects from puncturing the diaphragm, and have a short-term waterproof effect.
2. Housing:
The support of the entire microphone head, with other components encapsulated in the housing, is the ground point for the microphone and can also serve as an electromagnetic shield.
3. "Diaphragm: It is a major component of acoustic to electrical conversion, consisting of a taut Teflon plastic film attached to a thin metal ring. The side of the film in contact with the metal ring is coated with a very thin metal layer. The film can be charged, and is also an electrode plate that forms a variable capacitance, and can vibrate.".
4. Gasket:
The distance between the two electrode plates of the supporting capacitor is left with a gap to provide a space for the vibration of the diaphragm, thereby changing the electrical capacity.
5. Back plate:
The other electrode of the capacitor is connected to the G (gate) electrode of the FET (field effect transistor).
6. Copper ring:
Connect the electrode plate to the G (gate) electrode of the FET (field effect transistor) and play a supporting role.
7. Cavity:
Fix the plate and ring to prevent short circuit to the housing (S (source) and G (gate) electrodes of FETs).
8. PCB assembly:
Equipped with FETs, capacitors, and other devices, it also serves to fix other components.
9. PIN: Some microphones have a PIN (pin) on the PCB, which can be soldered together with other PCBs to connect another front pole type and back pole type. The structure is also slightly different.

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